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5250 Build Instructions

The 5250 PCB assembly contains components that are sensitive to electrostatic discharge (ESD) – please make sure you are wearing your wrist strap when handling.

Check Bezel for scratches and polish if required, clean with IPA, Insert gasket (202510).into Bezel casting (202268).

Atmel Programming

The PCB requires both bootloader via Atmel Studio and main program via Atmel FLIP. Before continuing connect the PCB to the NMEA cable at your bench and power on the device to 12V.

Bootloader

Connect the Atmel ICE tool to the PCB.

Open Atmel Studio
Go to Device Programming
Set fuses as per below picture
Flash the AVRBootloader.hex file from S:/Code/Production/5250 Deck Gauge/AVRBootloader.hex
Display should now read '88'.

Main Program

Power off the PSU
Hold a magnet over the right lip of the 7 segment display
Power on the PSU. Display should read '8'. If it does not, repeat steps 1-3.
Open Atmel Flip
Ensure ATMega64C1 is the selected device
Load the latest 5250 named hex file from S:/Code/Production/5250 Deck Gauge/
Press Run

Hardware Assembly

Rest printed glass (202271) onto the gasket, making sure correct orientation of glass and bezel casting. One hole at top and two holes at bottom.

Degrease polyacetal body with IPA and allow to dry before fitting. Place black polyacetal body into bezel casting and use hand press to snap into place.

Use hand press to snap black body into place, make sure to protect the body from damage. See next image.

Protect black plastic body.

Remove rubber grommet from connector.

Please ensure potting room is at the temperature 20-25 degrees Celsius. Heater and dehumidifier must be left on at all times (Check Thermometer before starting procedure.)

Pour clear gel (WACKER SILGEL) first - Wacker is 50/50 2 part solution, weigh into cup and then follow document Epoxy degassing instructions QMF18 on how to degas the epoxy. Check all air bubbles have dispersed.

Following Clear epoxy procedures 201266 – add just enough to cover the printed glass.

Brush face of display with degassed epoxy, and then gently place PCB into the clear epoxy taking care to align PCB in the correct orientation. Ensure PCB display lines up with printed window.

Once aligned correctly, back-fill to the height of the PCB Place unit back into de-gassing chamber.. Allow 24 hours before second potting procedure.

Inspection check before next stage – is the display lined up parallel to rectangular window, is PT1 lined up with round window? If the display has moved position Do not try to move it, remove clear potting and start again.

When clear epoxy is dry and PCB is securely in place, fill back of Deck Gauge with black epoxy compound 201265. Fill just below the lip of rotary switch taking care not to let potting compound go down into connectors or switch. Leave to cure for 24 hrs.

This board is now potted in black resin 201265 up to the level of the rotary switch.